Thermal Material

1740 series two-component silicone gel

Product features

application:

Widely used in various electronic products, such as: CPU assembly, thermistor, temperature sensor, power supply module, etc. It is applied to the filling between the heating element (power tube, thyristor, electric heating pile, etc.) and heat dissipation facilities (heat sink, heat sink, shell, etc.) in various electronic and electrical equipment, acting as a heat transfer medium and preventing moisture, Anti-corrosion, anti-vibration and other properties.

Features and advantages:

KINGBALI 1745 series thermal conductive adhesive is made of silicone resin as the base material, adding thermal conductive fillers and bonding materials. It has excellent weather resistance, low mechanical stress and high compression deformation performance, superior dielectric properties, and no volatiles. It has low consistency and good construction performance, with self-adhesiveness, suitable for filling in irregular gaps.

? Low thermal resistance;

? Excellent environmental resistance;

? Low shrinkage, meeting process requirements during precision period, and having good water resistance;

? High material stability, slow thermal conductivity decay, meeting the long-term use requirements under thermal cycling conditions.

EIGENVALUE

characteristic	1741	1742	1743	1744	standard test
colour	gray	Light red	Light blue	Light blue	Visually
Viscosity after mixing	40 ~ 50 Pa.S	40 ~ 60 Pa.S	40 ~ 70 Pa.S	80 ~ 120 Pa.S	ASTM D2196
Thermal conductivity	1.8 W/M.K	2.0 W/M.K	3.0 W/M.K	4.0 W/M.K	ASTM D5470
Minimum filling thickness	0.05 mm	0.05 mm	0.1 mm	0.1 mm	ASTM-D374
Glue output (0.6 atmospheres/3S)	0.7~1.2 G	0.7~1.2 G	0.8~1.4 G	0.6~1.0 G	/
Breakdown voltage (1mm)	≥5 KV/mm	≥5 KV/mm	≥5 KV/mm	≥5 KV/mm	ASTM D149
proportion	1.85 ± 0.2 g /cm³	2.6 ± 0.2 g /cm³	2.85 ± 0.2 g /cm³	3.02 ± 0.2 g /cm³	ASTM D792
Operating temperature	-40~200 ℃	-40~200 ℃	-40~200 ℃	-40~200 ℃	EN344
Volume resistance	≥10 ¹² Ω-CM	≥10 ¹² Ω-CM	≥10 ¹² Ω-CM	≥10 ¹² Ω-CM	ASTM D257
Flammability rating	V0	V0	V0	V0	UL_94
When the surface is dry (25℃)	20 ～ 30 MIN	20 ～ 30 MIN	20 ～ 30 MIN	20 ～ 30 MIN	/
Curing time (25℃)	≥50 MIN	≥50 MIN	≥50 MIN	≥50 MIN	/
Curing time (60℃)	10 ～ 15 MIN	10 ～ 15 MIN	10 ～ 15 MIN	10 ～ 15 MIN	/
Curing time (100℃)	5 ~ 10 MIN	5 ~ 10 MIN	5 ~ 10 MIN	5 ~ 10 MIN	/
Note: The data recorded on this website are representative values ??rather than guaranteed values. To improve product performance, specifications are subject to change without notice. The use of the product recorded in this website is just an example. The product can have a variety of different application scenarios and environments, which are beyond our control. Therefore, whether the product is suitable for your production process and conditions, you need to make full use of it before using it. Evaluate to confirm whether its performance and effect are in line with expectations. For applications that need to be considered safe, please test and confirm their safety in advance. In addition, the company does not guarantee that the purposes recorded on this website will not infringe any patents. Before using this product, please carefully read the explanatory text and safety data sheet (MSDS) marked on the main body of the product. This product is manufactured for general industrial applications. Do not use for medical purposes. The product may precipitate during storage. This is a normal phenomenon. Please mix well before use and strictly follow the product storage and transportation instructions. In order to obtain the best performance, the bonding surface should be clean, dry and free of grease. For high-strength structural bonds, special surface treatment can increase bond strength and durability. The material taken out of the container may be contaminated during use. Do not put the material back into the original container. Kingbali® cannot be held responsible for products that are contaminated or stored under non-instructed conditions.